1. Advanced dark infrared technology, give more even heat during reworking. 2. New added USB interface, can be connected with computer easily.3. Closed-loop temperature control 4. Advanced external OMEGA K type thermocouple wire provide accurate temperature detection.5. Alarming function. When soldering or desoldering will be finished, it will alarm before 3-5 seconds.6. No hot air during rework process, make even heat and protect the surrounding compnents from damage and deformation.7. Can store 10 groups of temperature profiles. Two groups already stored for using.8. Can be controlled by the IRSOFT temperature software.9. Two temperature zones, work independently, temperature parameters are adjustable and correct per actual need.10. Can rework BGA chip size large as to 65x65mm
procedures manual: steam- assisted gravity drainage water achi ir 6000 manual analysis handbook doc022. different temperature profiles give the opportunity to choose necessary soldering mode for different solders, including the lead- free ones. vale lembrar que os controladores utilizados pela achi ir 6000 são controladores de uso geral, fabricados pela altec, as configurações que abordamos neste documento são as informações necessárias para o uso do equipamento, as demais opções de configuração do controlador fica por conta e risco de cada um. achi irto hh( þpakpachafl pemohthafl ctahuhh, rupeaha3haqehhafl mohrra3ka, jlemohtaxa h 6eccbhhuoboü naìikh cjio) khb1x 3j1ektpohhb1x kom110hehtob ( bga, cbga, ccba,.
JDSU MTS6000A-C1004-CPSFP-CPXFP-CPE1BNC CPDS1BANT-CPE3DS3BNC-CPE4STM1Highly integrated field optical test solution for single applicationThe MTS-6000 is a compact and lightweight test platform designed for the installation and maintenance of
6 IR6000 Rework station for laptop motherboards, desktopcomputer motherboards,server boards, industrial computer boards,all kinds of game boards, communicationsequipment motherboards, LCDTVs and other large circuit board BGA rework.
7IR6000 Innovative designs .An effective solution to general ofinfrared reworkstation vulnerable to the impact of air flow. Willlead an inaccurate of temperaturecontrol. Maximum temperature up to400 C. Can easily deal with lead-free solderingrework.
2 IR6000 Rework Station sensor Direct contact with motherboardSoTemperaturedisplay is Actual temperature3 In order to avoid damageto the motherboard capacitorSO use insulation tape pleaseMaintenance completed ,then Removal of insulation tape So as toavoid short-circuit4 After removal of BGA chip PCB Bonding Pad Needto clean up Avoid cold solder jointSee BGA chip tin completelyliquefied, Then To move the BGA chipSo as to avoid BondingPadDamage 5 BGA chips should be subject to settlement, floating stateProhibited in all solder balldid not fully liquefied, by force ifremoval of chips, so as to avoid pad off, chip ormotherboardscrap! 1e1e36bf2d